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bowing...what the hell is that?

sabregen

Fully [H]
Joined
Jun 6, 2005
Messages
19,501
I hear this term mentioned only on these WC question areas. what is bowing? Is it good, bad, should I care? Someone give me the retards explaination...I'm missing something here.
 
Bowing is basicly bending the copper base, Thats probbly the worst explnation I can give, but its a correct one.

Basicly you "bow" the base so the middle of the base is more outward than the outer sides, so when you screw it down it makes better contact with the core.

BUT this only works well on Intel cpus WITH the IHS, on AMD chips you will get less performance if you bow the waterblock, and if your crazy and de soder the IHS off an intel CPU, a bowed waterbock will give less performance than a non bowed one.

The reason why it works on only intel chips and not AMD chips? I'm not enitrely sure but I think its got something to do with the mounting method on the LGA 775 socket.
 
Understood, so it's manually shaping/bending the backplate used for the GPU waterblock? I think I understood that to mean what I think it means...which is what I just wrote (coming with me on that one? good!) :D So, basically, you're just bending the retention bracket to apply the pressure more evenly one way or the other to the CPU die (or IHS, as the case may be), depending on the need of the application, right? And I suppose that lapping either companys chip IHS would likely yeild better results than bowing your block...unless both are necessary ( in some cases)
 
No, bowing isn't the backplate. It's using a washer (usually) to physically warp the base of the waterblock (CPU or GPU) to make it convex rather than perfectly flat. The thinking is that by making it convex, you'll apply more pressure directly in the center (presumably right over the CPU die).

From Swiftech, re: Apogee GT and GTX:
http://www.swiftech.com/assets/images/products/apogee/GT-Bowed-TR_VS_FR.PNG
http://www.swiftech.com/products/ApogeeGT.asp

As for why Intel and not AMD, the general concensus is that Intel's IHS is poorly implemented- I think that the stepped sides let it flex a lot more than AMD's edges, which have a straight 90-degree brace.

I'm pretty sure that this has more impact on single-die chips, since Intel's dual-die designs (Smithfield, Presler, Kentsfield) should have a slightly better pressure distribution without any of these tricks.
 
Understood, so it's manually shaping/bending the backplate used for the GPU waterblock? I think I understood that to mean what I think it means...which is what I just wrote (coming with me on that one? good!) :D So, basically, you're just bending the retention bracket to apply the pressure more evenly one way or the other to the CPU die (or IHS, as the case may be), depending on the need of the application, right? And I suppose that lapping either companys chip IHS would likely yeild better results than bowing your block...unless both are necessary ( in some cases)

If it's a socket 775 CPU you'll want to do both.
 
Someone care to explain and give pretty pictures on what should be done for orrect implementation?
 
Umm interesting, looks like that guys has high temperatures 61C - 66C for D-tek Fuzion.
 
The only real problem with bowing is it's a one way operation. Once you done it, you can't reverse the process unless you buy a replacement base, since the base takes on a permanent warp.
 
Lapping the IHS and waterblock can have similar effects. This can be done yourself, or you can find a local surface finishing company to lap a waterblock and IHS to have an ultra-flat mated finish.
 
I hear this term mentioned only on these WC question areas. what is bowing? Is it good, bad, should I care? Someone give me the retards explaination...I'm missing something here.

Bowing is a technical term for what happens to certain people when Cathar speaks. :D
 
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