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better than thermal compound???

N

nst6563

2[H]4U
Joined
Sep 15, 2003
Messages
4,023
Has anyone ever seen or used a Panasonic "PGS" (Pyrolytic Graphite Sheet)???? I ran across it in a Digi-Key catalog and it has the following claims....

Features: • Excellent thermal conductivity: 600 to 800 W/(m.K), twice as high as copper, three times as
high as aluminum • Light weight: the same as water (Specific gravity: 1.0 g/cm3), 1/9 that of copper, 1/3
that of aluminum • Flexible sheet, easy to be cut or trimmed and withstands repeated bending • High heat
resistance: Stable up to about 400°C even in the air • Low thermal resistance • The main component is
carbon. Minimal impurities and outgassing • Excellent heat transferring performance. Heat sink and even
distribution of heat


Link: http://dkc3.digikey.com/PDF/T041/0526.pdf


I also ran across this other item from AAVID called the Ultrastick.
it has the following features....
• Thermal resistance 20% lower than thermal
grease, with significant long-term reliability
benefits
• Excellent heat transfer properties, consistent at
mounting pressures from less than 5 psi to
more than 200 psi
• No run-out, migration, dry-out, or flaking that
can occur with typical thermal grease
• Non-toxic and inert
• Electrically nonconducive
• Easy to use and dry to the touch after
application, reducing labor costs
• Each bar covers approximately 1,000 in2

Link:http://dkc3.digikey.com/PDF/T041/0528.pdf


If any of the claims of these two products are true, why aren't they more widely known???? I mean, with a thermal conductivity 2x of that of copper...I would think that's some impressive stuff...(take with a grain of salt as I don't know the thermal conductivity of AS3/5/ceramique/alumina)
 
one problem with the first one is that it is a sheet.

it cannot fill in the microscopic gaps between hsf and processor.
 
I realize that...but if the claims are true, then if those two items were combined...it could provide some decent results...wouldn't it???

just curious
 
from what I understand, combining multiple layers or materials, etc, is generally not a good idea, since it creates more spaces for gaps, however small they may be.

however, I would be interested in hearing more opinions on the second substance...
 
I find that with lapped HSF's, almost all the paste gets squeezed out anyway. Isn't it the ideal situation?

I haven't found any difference whatsoever between white goop and premium stuff when using properly lapped heatsinks.

Oh well.
 
The ideal enviroment would be one of 2 perfectly flat surfaces touching. The thermal pastes are designed to fill any voids, however big or small, thus if perfectly flat, as kleptophobiac has stated all the compond will be displaced by the flat surfaces.

Again I must agree with the extremely adept kleptophobiac.
I've tried AS3, 5 and cerqmique and realized only around 3-4c temp variation. The biggest gain was realized after doing a lap dance on my GPU:D
 
Originally posted by Ch1m3r4
from what I understand, combining multiple layers or materials, etc, is generally not a good idea, since it creates more spaces for gaps, however small they may be.

however, I would be interested in hearing more opinions on the second substance...
Click to expand...

yeah, me too...if it works as good as it says, and covers 1000 sqr inches...that makes it the best and cheapest thermal interface out there (next to a 12oz tube of toothpaste:p )
 
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