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Best solution for me? (E8400 currently)

L

LearninToBuild

Limp Gawd
Joined
Jun 14, 2009
Messages
132
I have an E8400 3.0GHZ, I haven't ran any 'stress tests' when gaming (don't really know how), however I noticed after quitting GW I was at like 80 degrees on Everest...

I only have a stock HSF and since i moved my CPU to a new mobo/case i haven't yet applied any thermal compound...

Right now I'm playin poker, have iTunes running, WoW installing and I'm at about 50-60 degrees...(sometimes i notice random higher flutters)

Is this processor really worth another HSF and thermal compound, or is there an even faster option for someone who has a 512MB 9600 GT (and has no need for a quad core or multi GPU solution)... I just want something so fast and better cooled that I can run the shit out of games like WoW and First person shooters...
 
If you are running it at stock speeds, then it should run much cooler if all you do is do a fresh layer of thermal compound and maybe get a little better air flow through the case. If your board can do any overclocking, it shouldn't be much trouble to take that chip to 3.8 or so with a better heat sink.
 
thefordmccord said:
If you are running it at stock speeds, then it should run much cooler if all you do is do a fresh layer of thermal compound and maybe get a little better air flow through the case. If your board can do any overclocking, it shouldn't be much trouble to take that chip to 3.8 or so with a better heat sink.
Click to expand...

Here's my board: http://www.newegg.com/Product/Product.aspx?Item=N82E16813128388

Also, this is my case: http://www.newegg.com/Product/Product.aspx?Item=N82E16811119160

So I have some good fan action from all angles.

Which thermal compound would you recommend (preferably on newegg or amazon) that is easy for a novice to apply? Also any HSF recommendations?
 
Usually if you move the CPU into another motherboard, you should always apply new thermal compound and remove the old one, to provide better contact between the two surfaces.
 
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