At AMD, Die Stacking hits the big time

[Cool Vibrations]

Interesting article about HBM

Cheung reminisced a bit about the early days, and said when ASE first met with AMD in 2010, they thought this project would be “another tombstone on the roadside.” There was no product roadmap in place, no ecosystem or supply chain. They viewed it as a proof of concept program with numerous challenges including CPI, thermal issues, backside thinning processes were risky, as was bonding and assembly. TSV test reliability was still being figured out, as well as failure analysis resources.

“So how did we get here? It was a huge commitment of resources, capex, new process equipment, and technology core competency development,” said Cheung.

 

[cageymaru]

Pretty awesome! Thanks for finding it and sharing!