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AS5 or AS Ceramique?

8

88mph

n00b
Joined
Apr 2, 2004
Messages
8
I'll be moving my processor into a shuttle XPC pretty soon and I was wondering what I should go with for installation. I've heard AS5 has slightly better thermal conductive properties, but that Ceramique has less "curing" time and is easier with clean up.
Any info whether preferences or cold hard facts I'm missing out on would be appreciated.
 
Try soldering the hsf on. Soldering is a very heat-effecient bond. You have to use a low-temp alloy and a blowtorch though.
 
Ya about that.....

Thats a negative ghostrider.
I've used regular generic thermal paste in the past, I was just wanting to try AS becasue I heard it does a pretty good job of keeping the temp's down.
 
Depends on what you want. I prefer ceramique due to it lasts longer than ASIII and from what I heard longer than AS-V, and its less of a pia to apply and take off. But thats my opinion :)
 
I like ceramique myself. plus its about 3-4 bucks shipped :D
 
either, but i think ceramique is a bit easier to apply, and much easier to clean. You can buy a BIIIIG applicator of Ceramique at SVC for cheap! Very cost effective
 
Originally posted by StrongBadia
I use ceramique because it's non-conductive. No risk of frying your chips.
Click to expand...

I've used as3 in the past on several exposed core chips (p3 and AXP) with NO problems, just be careful
 
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