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amd64 and tim cooling

aixenv

n00b
Joined
Dec 5, 2004
Messages
10
well i just built my new system, specs are:

MSI k8n neo2 plat w/amd 64 3500+ winchester
thermalright xp-90 w/92mm tornado and both stock case fans
case: thermaltake shark (black)
2gb of OCZ el plat rev2
nvidia 6800gt
audigy 2 zs
2 74gb wd raptors in raid0 (yes i know raid 0 can crash, not a concern)
1 200gb wd 7200 sata drive

so well i was running temps of 42-44 in the bios and mbm5 showed 44 on the cpu,
this isn't horrible but i didnt feel very confident about my first job of putting tim on the die, so i decided to take my system apart and see if i could clean up the tim and reapply

i had the feeling i put way too much tim; when i took all the components out and then got the heatsink/cpu to a place where i could look at them i did notice seepage over the sides of the die so i was correct in the fact i put too much tim, so i took it apart carefully and cleaned it off and then did some research, i went to http://www.arcticsilver.com/arctic_silver_instructions.htm and found that very helpful, i applied a bb sized amt of arctic silver 5 and then reseated the heatsink and gave it a few clockwise and counterclickwise turns to get rid of the potential air bubbles.

well i find it very interesting to note that now in the bios and in mbm5 i am showing what i consider a drastic temperature difference of 7-10 degrees celsius

currently im running 18case and 34 on the cpu, in mbm5 and bios shows 29-33 and 21 for the case and cpu temps

has anyone else had similar experiences?
 
A lot of people would see the same results. Too much TIM produces a blanket effect, holding in heat. Less is better.
 
Just to let you know a useful tip with the xp-90 the instructions thermalright gives saying to spread the TIM over the HS base and IHS gave me the best results I tried the dab in the middle method also which is what I usually do but the results were not as good. If you spread the TIM real thin on both surfaces it works really well and the fact that the heatpipes cover the entired base area that contacts the cpu optimal contact between all surfaces is probably the best as thermalright suggests.
 
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