![[H]ard|Forum](/styles/hardforum/xenforo/logo_dark.png){kind=logo}
Question about vga overclocking
- Thread starter Matas
- Start date
Well there can be diference in PCB (allthough today almost all companies work with reference PCB design, Asus comes sometimes with own design)
More layers PCB and PCB that has less EMS problems will OC higer.
Second components around chip like mosfets in power supply/ Voltage regulator module can play big role. Caps,coils as well. More currrent with stable voltage onboard VRM can deliver more pure power chip can have.
And last but not least GPU's are also made in wafers. Like take a 10" waffer. Like last 1/2 "arroun You can trow away. Cores closer to center are usualy better overclockers but if some of them have came in contact with some elements (light dirth moisture what ever) those might be defect or work worse then others. So any of all of those chips on wafer can be better then other. Only affter longer time of production of same wafers Companies make higher yilds and then most of a chips OC same.
Also bad Thermal interface material can be crusial.
Also like imagine Company X getts 2 milion 1,4 ns memory chips from Samsung and they come from batch A and Company Y getts it also but from batch B they can be just different and OC diferently.
Even in samebatch there are 8 chips on most of a modern cards and memory is as fast as slowest chip from those 8 chips.
Many factors play role not just a cooler.
Even same cooler can have fan with better or worse bearings and better or worse copper etc etc.
There are no two same electronical devices.
MD
More layers PCB and PCB that has less EMS problems will OC higer.
Second components around chip like mosfets in power supply/ Voltage regulator module can play big role. Caps,coils as well. More currrent with stable voltage onboard VRM can deliver more pure power chip can have.
And last but not least GPU's are also made in wafers. Like take a 10" waffer. Like last 1/2 "arroun You can trow away. Cores closer to center are usualy better overclockers but if some of them have came in contact with some elements (light dirth moisture what ever) those might be defect or work worse then others. So any of all of those chips on wafer can be better then other. Only affter longer time of production of same wafers Companies make higher yilds and then most of a chips OC same.
Also bad Thermal interface material can be crusial.
Also like imagine Company X getts 2 milion 1,4 ns memory chips from Samsung and they come from batch A and Company Y getts it also but from batch B they can be just different and OC diferently.
Even in samebatch there are 8 chips on most of a modern cards and memory is as fast as slowest chip from those 8 chips.
Many factors play role not just a cooler.
Even same cooler can have fan with better or worse bearings and better or worse copper etc etc.
There are no two same electronical devices.
MD
