Question about applying AS5

E

Emraith

n00b
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Dec 16, 2006
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Newb question here. I've checked and read, adn seem to keep finding conflicting info on this, so i'm asking it here..

Correct way to apply thermal paste, ie AS5?

A. 1 very small dot in the middle, tighten heatsink, let it spread out on its own
B. 1 very thin line down the middle of the cpu, tighten heatsink, let it spread out on its own
C. Apply a very small amount, spread very thin layer over cpu, then tighten heatsink (way ive always done it..not sure if its right)

Is there actually a 'correct' way to do this? Is one way better than the other?
 
personal preference, and peace of mind, really. I prefer method #3, always have, and always will. I look at it like this:

Method #1: If you drop enough in the middle, then you'll get complete coverage when sandwiching on your HSF assembly. However, the likelyhood of complete coverage is very slim. It is more probable that you will experience one of two things:
a.) not enough, resulting in metal on metal contact from core to HSF, poor heat dissipation
b.) too much, resulting in AS5 oozing out from under your HSF assembly. While it's not electrically conductive, it is mildly capacitive, and that's not good if it gets into touching other components, other than the IHS, or core.

Method #2: See above, you'll likely get the same results.

Method #3: Ensures even coverage, to the best of your ability to have a stable hand, careful eye, and concentration. Better to have complete coverage than coverage in some areas and not in others. Keep in mind, you want the layer to about 1/32" thick, all the way across. This will prevent AS5 from oozing from the outer edges of the sandwich (think of when you smash a PBJ). Thicker is not better. Apply just enough to make contact possible. I usually apply the heatsink at a slight offset (twisted), then turn into position for HSF mounting bracket and socket to line up for mounting. This can help eliminate bubbles (if present). Remember, what you are going for is non-metal to metal contact. It's not necessary to press the assembly down with anymore force than you would use to put your CPU into the socket. Most of the time, the weight of the HSF (if it's quality...and it should be, if you're OC'ing) is enough to properly seat the unit.

Good luck!
 
Have you read through this yet.

In my opinion you want to use as small an amount as possible. Just enough to fill in the slight grooves in your hs, and that's it.
 
i always run a very thin line on one edge, and use single edge razor blade to smear thin coat across chip. my $0.02
 
Actually, if you take a visit to Arctic Silver's website, they now have different application recommendations for different CPUs.
 
NordicRX8 said:
Actually, if you take a visit to Arctic Silver's website, they now have different application recommendations for different CPUs.
Click to expand...

the best method hands down;)


I go with #1 personally:)
 
method #1 works great, i have pulled the cpus off after a while to switch chips and whatnot and they are always perfectly spread around evenly....
 
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