Gallium and aluminum are not good friends.
Gallium and aluminum are actually awesomely good friends, which is actually the problem here. It sort of seeps into the aluminum and refuses to leave, like that crazy ex that most of us have stories about.
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Gallium and aluminum are not good friends.
Gallium and aluminum are actually awesomely good friends, which is actually the problem here. It sort of seeps into the aluminum and refuses to leave, like that crazy ex that most of us have stories about.
I just made a quick video showing how this thermal compound dissolved and destroyed this stock Dell heatsink.
I couldn't find any results on google for it destroying any other heatsinks so I don't know how well documented this issue is, so here you can see the carnage for yourself:
For some reason when I post on here I get a lot of very negative replies so I almost didn't post this but I figured I would give it one last try. If it is still that way then I guess I will just stop posting since clearly I'm missing something about this forum that causes great incompatibility between myself and others. I'm just trying to build PCs and overclock and cool like the rest of yall. I hope everyone has a great day.
That's not true they are the best of friends and that is the issue they are bad for each other and get each other drunk then the next thing they know gallium is preggers with aluminum and aluminum just wastes away trying to pay for the kids gallium keeps having.Gallium and aluminum are not good friends.
Mayo is where it's at, Bruh
Meh i still have a lifetime supply of AS5 even some of my AS1 left and 2 tubes of Ceramique... so i am set for paste even if there are better. We are talking a temp difference of 1-2*
regardless i am not going to go out of my way to chase the extra 1-3C and buy more compound when i have a tube of AS1, AS3 and 5 tubes of AS5 and 2 of ASceramique i got the AS5 and Ceramique at radioshack when they were going out of business... yeah i have seen the reviews between various pastes and the range was 76C vs 71C with the "BEST" one being one of those liquid metal ones and it was as5 at 100% load was 53.6C with the liquid metal at 100% it was 49.5C i am not going to buy a new paste for 4C drop.On lapped HS/block the difference can be as high as 8-10C, same with delids. Back when these first hit the market I used it on my lapped TRUE and lapped CPU combo and got a drop of 9C on the hottest core, difference between the best "normal" TIM and the average might be 1-2C, but not when taking about the liquid metal TIMs. They however do not perform as well on HS's with rough bases, due to very thin film thickness.
regardless i am not going to go out of my way to chase the extra 1-3C and buy more compound when i have a tube of AS1, AS3 and 5 tubes of AS5 and 2 of ASceramique i got the AS5 and Ceramique at radioshack when they were going out of business... yeah i have seen the reviews between various pastes and the range was 76C vs 71C with the "BEST" one being one of those liquid metal ones and it was as5 at 100% load was 53.6C with the liquid metal at 100% it was 49.5C i am not going to buy a new paste for 4C drop.
I also wonder if the testing i have seen takes into account break-in periods for each tim... as AS5 has a 200 hour where it needs to be heated and cooled before it reaches optimal interface...
My point was to point out the irony of the existence of a gallium based TIM when the primary material you wish to give a better connection to a copper/nickel plate is a giant finned slab of aluminum which is well known to be devoured by both gallium and mercury. Furthermore i'll point out the op used this TIM on a stock dell HSF which likely saw no real gains in cooling vs say a cheaper more practical TIM.Soooo....If you have no interest in using a higher performing TIM.....Why did you post here?
I don't have the time to read EVERYTHING you damn guys type. I just roll over here between data points.Damn you. I said exactly that in my previous post.
My point was to point out the irony of the existence of a gallium based TIM when the primary material you wish to give a better connection to a copper/nickel plate is a giant finned slab of aluminum which is well known to be devoured by both gallium and mercury. Furthermore i'll point out the op used this TIM on a stock dell HSF which likely saw no real gains in cooling vs say a cheaper more practical TIM.
And the 1st page has examples where a proper cooling solution was used and this happened to touch part of the aluminum... The problem is more that a substance known to alloy destructively with more than just aluminum is used all for the sake of at best 3* over the next best solution... Gallium will alloy with other metals too just not as destructively...What the fins are made out of has nothing to do with the TIM. The base on most highend HS are nickel plated copper, not aluminum. If you are going to cheap out on a fully aluminum HS I doubt you are going to spend $15 on TIM. So there is no irony.
And the 1st page has examples where a proper cooling solution was used and this happened to touch part of the aluminum... The problem is more that a substance known to alloy destructively with more than just aluminum is used all for the sake of at best 3* over the next best solution... Gallium will alloy with other metals too just not as destructively...
Wait, does this mean it's not edible?
Not brussel sprouts!Everything is edible, at least once.
First time I LOLed today.Everything is edible, at least once.
Everything is edible, at least once.
Check the thread title and the posts after it.why they say specifically to not use on aluminum.