Ive never been a big fan of lapping (although I see no harm in doing so, Im just lazy). After taking apart a machine to RMA a failing mobo I noticed the etching in the CPU heat spreader and heat sink, it is blatantly obvious where the greatest contact is between them. If I take my time lapping do you think it would allow a better contact patch, I would assume that no matter what, this problem is always run into where the heat sink is putting more pressure on certain areas. Lapping would put it more in the center wouldn't it? from what i've seen of lapping it usually domes the heat spreader/heat sink a little.
The contact patch seems pretty even though AROUND the cpu heat spreader, but not in the center. When I pulled up the heat sink the suction formed a perfect X through the center. I would imagine that is good.
Just want some opinions(supported) and experiences w/ lapping stuff.
EDIT: almost forgot these.
The contact patch seems pretty even though AROUND the cpu heat spreader, but not in the center. When I pulled up the heat sink the suction formed a perfect X through the center. I would imagine that is good.
Just want some opinions(supported) and experiences w/ lapping stuff.
EDIT: almost forgot these.