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- Joined
- Aug 20, 2006
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Here's a look at water pipes, two-phase cooling, heat sink hybrids, and carbon nanotubes as possible solutions for taming the temperatures of CPUs in the future.
heat sinks and fans wont cut it for future processors, which will be 3-D stacks of ICs. Such layering can trap heat between chips, making getting rid of it even harder. Researchers are exploring better ways to cool chips and gadgets, either by redesigning tried-and-tested methods or drastically overhauling them.
heat sinks and fans wont cut it for future processors, which will be 3-D stacks of ICs. Such layering can trap heat between chips, making getting rid of it even harder. Researchers are exploring better ways to cool chips and gadgets, either by redesigning tried-and-tested methods or drastically overhauling them.
. One thing that hasn't really been talked is turbulence generating devices in air haet sinks (dimples on surfaces, winglet generators, etc) since they're going to try to push the air side of things as long as they can.
