Intel’s Nova Lake-S LGA1954 52 cores

I'm going to wait untill Nova Lake comes out anyway really would like a 270k I guess I can wait I mean my 14700k has been rock solid a Israel chip it's not like it will be dated in two years.
 
top 300 watt chip
good news, bad news, that mean that Intel way to put cache the 3d cache below the cpu instead of above with their really good Foveros packaging, so that the extra cache do not hurt cooling capacity do seem to work has intented in that regard. In it is ceiling at least here.
 
good news, bad news, that mean that Intel way to put cache the 3d cache below the cpu instead of above with their really good Foveros packaging, so that the extra cache do not hurt cooling capacity do seem to work has intented in that regard. In it is ceiling at least here.
Oh I didn't know they layered the chip that way like they did with 3D Xpoint.
 
Oh I didn't know they layered the chip that way like they did with 3D Xpoint.
we will have for people to look at them with scan or what not to make sure they achieved full real 3D or 2.5D (cache side-by-side instead of below), but in both scenario it is not over the compute and it let them run those crazy power level.
 
My guts says Intel planned to dual source the compute tile from the start & what will be interesting is the 18A-P/TSMC 2nm ratio. If you think about the current political environment dual sourcing makes a lot of sense. All these tariff wars, plus China treats chips as being made where they are fabbed and treats Taiwan as domestic. One China policy. If the chips are fabbed in Taiwan Intel can send them to the US for packaging then export them to China without paying import duties, at least on the fabbed in Taiwan bits. Or maybe they do the assembly in Malasia or Costa Rica. So basically dual sourcing = tax dodge.

Maybe I'll buy one of these. Mostly comes down to tests after it comes out. I'm not buying anything until the dual tile Nova Lake chips with large cache and Zen 6 X3D are both out.
 
If the chips are fabbed in Taiwan Intel can send them to the US for packaging then export them to China without paying import duties, at least on the fabbed in Taiwan bits.
I think you are right and they usually make a single country of origin for tarrif, they do not split bits by bits, and use the essential part/character definition, which would tend to be where the compute tile was fabbed for a cpu, so the whole CPU become an Taiwan product for Chinese tarrif authority if the compute tile is from TSMC even if many other tile are from elsewhere, complex packaging from mexico and assembly in malaysia. Thewy do not do some clean VATS style, splt of values in percentage by country of origin usually.

And vice-versa, if the compute tile is Americna made, for the US market it become a 100% US made even if a lot of work is elsewhere.

But i really doubt that the reason for it, actual technical fear 18A-P would not work well enough must have been the driving force, over impossible to predict always changing tarrif policy, specially for a multi-years project like this.
 
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