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“Hot Chips 2026: SK hynix pushes hybrid bonding HBM5 as AI memory hits 775-micron ceiling — firm extends MR-MUF through Nvidia Rubin
Jaesik Lee laid out the physics capping HBM stack height and all-but-confirmed hybrid bonding misses HBM4E
SK hynix doesn't expect hybrid bonding to be ready for HBM4E, Jaesik Lee, VP of package engineering at SK hynix America, said during a presentation at Hot Chips“
https://www.tomshardware.com/tech-i...e-as-ai-memory-runs-into-a-775-micron-ceiling