VIA CenTaur CHA NCORE AI CPU Pictured, a Socketed LGA Package

[erek]

That is a really nice silk screen logo in my humble opinion

"Pictured below, the processor is a flip-chip LGA. We deduce it is socketed looking at its alignment notches and traces for ancillaries on the reverse-side (something BGAs tend to lack). On the other hand, the "contact points" of the package appear to cast shadows, and resemble balls on a BGA package. Topside, we see an integrated heatspreader (IHS), and underneath is a single square die. CenTaur built the CHA NCORE on TSMC's 16 nm FinFET process. The package appears to have quite a high pin-count for a die this size, but that's probably because of its HEDT-rivaling I/O, which includes a quad-channel DDR4 memory interface and 44 PCI-Express gen 3.0 lanes."

https://www.techpowerup.com/263978/via-centaur-cha-ncore-ai-cpu-pictured-a-socketed-lga-package

 

[EniGmA1987]

So this is probably a rebadge of the new chip that already came out built as a "collaboration" between china and Via?

 

[defaultluser]

So this is probably a rebadge of the new chip that already came out built as a "collaboration" between china and Via?

Well, that's what it looks like. The added AI accelerator is either

1. brand new addition to the core, or
2. a rebranding of the existing onboard graphics chip?

Here's an architectural PDF:

https://centtech.com/wp-content/uploads/MPR_19_12_02_Centaur_Adds_AI_to_Server_Processor.pdf