TSMC to Build New Fab for Advance Packaging

cageymaru

cageymaru

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TSMC is set to construct a new fab for advanced packaging. Huawei subsidiary Hisilicon has already placed orders with the company for use of TSMC's WoW technology. The plant will accelerate the foundry's IC backend business expansion as this will also strengthen its sub-10nm process segment.

TSMC's new advanced packaging fab will fulfill mainly orders demanding the foundry's CoWoS (chip-on-wafer-on-substrate) and integrated fan-out (InFO) wafer-level packaging, and its newly-unveiled system-on-integrated-chips (SoIC) and wafer-on-wafer (WoW) packaging services, the sources indicated.
 
Well I'm glad you understood that Mr. Smarty Pants because about 90% of that post and verbage (and especially acronyms) went well over my head. I'm gonna need Google and some visuals big time on this one. o_O
 
How long until TSMC is the only game in town? It’s not far off, and Intel could end up going fabless at the rate their not going!
 
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