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Toshiba is supplementing their BiCS flash lineup with a new 512Gb chip that can store 3 bits of data per cell. The company’s latest 3D NAND technology stacks 64 layers of flash, which provides 65% greater capacity than the previous generation’s 48 layers. Planned for the near future is a 1TB drive, which will comprise 16 of the new chips (64GB/512Gb) in a single package.
The new technology will enable a 1TB chip that will be used to create enterprise and consumer SSDs, the company said. Mass production of the new 512Gb chip devices is scheduled for the second half of 2017. The next milestone in the BiCS flash development roadmap will be the industry's highest capacity chip, a 1TB product with a 16-die stacked architecture in a single package -- in other words, 16 of the 64GB chips. Toshiba said it plans to begin shipping samples of its 1TB chip in April.
The new technology will enable a 1TB chip that will be used to create enterprise and consumer SSDs, the company said. Mass production of the new 512Gb chip devices is scheduled for the second half of 2017. The next milestone in the BiCS flash development roadmap will be the industry's highest capacity chip, a 1TB product with a 16-die stacked architecture in a single package -- in other words, 16 of the 64GB chips. Toshiba said it plans to begin shipping samples of its 1TB chip in April.