Don't know, but unless you attach it with something with extremely low thermal resistance (like the solder on SB), there is physically no way a "heat spreader" assists cooling compared to a properly designed cooler directly on the die (and even then, if you could solder the cooler like the SB IHS, the direct die cooling would still be better).
You might have a heatsink that doesn't work on the smaller die due to being designed for a different type of contact (especially the heat pipe types), but anyone who says adding an extra layer of high thermal resistance between your cooler and the die is beneficial just doesn't understand physics. They may be able to type a lot and ridicule, but they exhibit a fundamental lack of understanding.
Yes I understand all of that. The point of my facetious post was that there were a few of us who tried to point out that it did matter that Intel decided to go cheap and use grease instead of solder with IB - that it most likely would have made a fairly significant difference in temps - and we had to suffer several numbnut fanboys shouting us down and telling us we didn't know what the hell we were talking about - that it didn't matter basically "because Intel." It was horseshit.
The point was IF one is going to have an IHS then solder is the way to go. Period. It would have made a difference. How much we will probably never know. But no one wanted to hear that. They still don't. Intel screwed everyone by releasing a decent but hot chip by going cheap with TIM between the chip and IHS. In a world free of fanboys people would be more irritated about that and thinking people wouldn't have to suffer their bullshit.