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The release of HBM3 is far off and specifications could change, but slides from a recent Rambus event indicate that the next iteration should offer 4000Mbps of bandwidth. HBM3 will feature an increased stack height and be built on the 7nm node. Additionally, there is a little insight on DDR5.
It isn't expected that we will see 7nm semiconductor products until 2019 at the earliest. Rambus also mentioned DDR5 on two of its slides. In the first slide, sitting alongside the HBM3 in development box, you can see DDR5 mentioned. The key info here is that DDR5 will deliver an expected bandwidth of 4800 to 6400Mbps. Like HBM3, it is set to be fabricated at 7nm.
It isn't expected that we will see 7nm semiconductor products until 2019 at the earliest. Rambus also mentioned DDR5 on two of its slides. In the first slide, sitting alongside the HBM3 in development box, you can see DDR5 mentioned. The key info here is that DDR5 will deliver an expected bandwidth of 4800 to 6400Mbps. Like HBM3, it is set to be fabricated at 7nm.
