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Both Intel and flash partners Toshiba/Western Digital released QLC announcements this week, with the former producing its first QLC SSD for the data center and the latter discussing their 96-layer BICS4 3D QLC NAND chip, which can store up to 1.33 Tb of raw data (166 GB). In contrast to TLC flash, QLC will be cheaper and offer higher capacities, but lower endurance and performance.
SSDs come with up to 16 die per package, so that means Toshiba and WD will soon be able to pack in a whopping 2.66TB of storage into a single NAND package. The duo plans to begin sampling the BiCS4 QLC NAND in September and mass production is slated for early 2019. More importantly, WD's release clearly states that QLC SSDs will come to the consumer market under the SanDisk brand name. We expect Toshiba to follow suit with its own consumer SSDs.
SSDs come with up to 16 die per package, so that means Toshiba and WD will soon be able to pack in a whopping 2.66TB of storage into a single NAND package. The duo plans to begin sampling the BiCS4 QLC NAND in September and mass production is slated for early 2019. More importantly, WD's release clearly states that QLC SSDs will come to the consumer market under the SanDisk brand name. We expect Toshiba to follow suit with its own consumer SSDs.