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Yeppers. Delidding 13 years ago....before it was cool.are those cracks i see?
Good eye.Is that a Ratpadz I see?
Coollaboratory
Liquid Pro/Ultra Thermal Compound
Im embarrassed that my grease is down at the bottom, debit card out tomorrow and off with the water block !
Anyone know the name of the liquid metal product? or link? Also what kind of glue does he use to relid?
I know this post is nearly a month old, but I have to share some of my results on this whole " you cant use LM or LMU on a vertical setup" nonsense..I have used it on well over ~15 de-lidded direct die mounts in a standard ATX MB, and at least 10 re-lidded setups, going back to 2012...I haven't had a single failure, and we are knocking on the door of 5 years of use here...Using Liquid Metal isn't a solution tho for a commercial product or a system that's vertical
In most cases its not about the TIM, but about the gap.
I know this post is nearly a month old, but I have to share some of my results on this whole " you cant use LM or LMU on a vertical setup" nonsense..I have used it on well over ~15 de-lidded direct die mounts in a standard ATX MB, and at least 10 re-lidded setups, going back to 2012...I haven't had a single failure, and we are knocking on the door of 5 years of use here...
The stuff doesn't run like water guys..I use a cheap throw away water color brush, and lightly coat the entire die before mounting the water block or re-lidding..
So you also create a setup that cant be used in a commercial product. Either no lid or relidded directly on the die using a razor thin layer. You have to think on what would work for everyone in any situation. Including lasting for 10 years+.
Where in my OP did I say anything about creating a "setup that cannot be used in a commercial product?" I simply stated that the claim you and others have made about CL and CLU "leaking" and ruining systems is FUD. Period. I offered my experience on 25 systems that use this very setup without a problem. I think you like to argue just for the sake of arguing..Thank God I didn't mention AMD in my post .........
Most people recommend CLP/CLU on the die and TIM on top of IHS because otherwise that happens (too many metal reactions with aluminum/copper).So what happens when you cant use a razor thin layer? Either it runs or is solidifies doesn't it?
https://forums.anandtech.com/thread...ne-through-the-roof-after-few-months.2419707/
http://www.coollaboratory.com/pdf/manual_liquid_pro_englisch.pdf
You know it's funny that it's actually mentioned that the ultra solidifies in the manualMost people recommend CLU under the IHS and TIM on top of IHS because otherwise that happens (too many metal reactions with aluminum/copper).
changing the already good heat conduction for the better, also safer
Vote with your wallet. I don't think anyone at Intel made you buy anything.but isn't intel a crook though forcing us to cut silly corners for things to work like it is 1999?
Open the video description (show more) - everything named and linked (amazon / caseking.de) there.
You can also come to http://www.hardwareluxx.de/communit...-ohne-hs-mit-gewechseltem-tim-891243-346.html and ask him there. His username is "Stullen Andi" - nice guy btw.
So your also saying and would agree a Titan Pascal that throttles due to shit heatsink is working as advertised and totally cool?What does this mean? Does it not work as advertised?
it throttles at stock boost.Is it throttling due to overclocking? Then yes, that is pretty much expected when it gets too hot.
being advertised as an overclocking chip (K) and cutting edge while cutting corners that cripples its performance is not something you should accept so stop spewing your crapIf it is not running at stock specification then sure, you have every right to RMA it. I'm not sure what the problem or disagreement is.
The "TIM BEING CRAP" designation is from this thread, as far as I've seen is due to people overclocking or delidding, both which throw warranty out the window (well, unless you purchase the Intel overclocking warranty add-on...is that still around btw?). Even so, no overclock is guaranteed.
You do realize the boost for 1 core is higher than 2/3/4 in most cases, right?
Thank you very much Folterknecht
It´s me, Stullen Andi from Hardwareluxx Forum. The TIM I´am using to apply on the core is Phobya Liquid Metall or Thermal Grizzly Conductonaut. The Coollaboratory stuff I only used once cause it´s not as good as the phobya or conductonaut stuff.
Here you can see how easy it is to apply it to the die, but I am not using the brush that comes with the tim.
Actually it dates back to 2003. Ask me how I know.As far as I know the delidding starts in 2012 in hwluxx forum and there are cpus I know that running more than 3 years without a problem. My first cpu is working 1 and a half year without any difference in temp.
cotton tip/q-tip i think is what you mean above.Hehe, I can remember people that even milled the IHS from P4 down, but what I mean is the following thread. It started as the Ivybridge cpu were released and delidding was more common.
https://www.hardwareluxx.de/communi...ngen-ohne-hs-mit-gewechseltem-tim-891243.html
Tell me the story from 2003 I am reading the forum since 2002 but don´t remember everything.
Always had luck with putting the sand paper down on a thick glass mirror and then lapping the IHS on that. Nice and flat.Problem is applying even pressure and not making it worse.
I know what you are saying. Physics...I get it.lapping...what do you mean?
my point is event with a "straight edge" its hard/impossible to apply 100% equal pressure.....not sure how to explain this in words lol.
Pretty much. Although they well never be "straight."how does that work?
seeing if lines are straight?
OK, thanks for the insight.paper doesnt look flat in photo and seems to be not a good example.....
Sorry, missed the question.are you being sarcastic?
that was a question....did you take photo? to me it looks like graph paper has bubbles.
479 wow
Put a piece of graph paper down on a flat surface. Look at the reflection in the mirror finish. Are the blocks in the reflection still square? If yes, it is "flat." If no, then it is not "flat." Does that help you understand better? I am not sure of what you are confused about. Sorry for my snapping at you. Please post your question here and I will try to answer it.Dude!!!....It was a legitiment question. I am trying to understand how it works because i would like to try it....chill pill
I was simply asking if i was understanding the photo right...damn man
I really do not know brother. When we had wavy mating surfaces it was an easy way to show it to our readers.my question is about angles and distortions. Like are the squares going to look more trapezoid on the upper parts? or is that not an issue?
I am curious about the angle of reflection causing distortion. Did you notice that as being an issue?
I assume we are looking at only single squares and not the whole image?
Sorry is the trapezoid distortion making sense? :/
I doubt they would use higher quality TIM on the lower end CPU's.So what do you guys think are the chances that the newly rumored i7-7740K and i5-7640K have better TIM?
silicon lottery said its merely a lack of application pressure which is why it seats too high.I doubt they would use higher quality TIM on the lower end CPU's.
I think there is also an issue with the Z height which is the distance of the die to the IHS. Removing the glue or whatever they use helps the IHS sit closer to the die.