http://www.tomshardware.com/news/htc-android-smartphone-m8-prime,26830.html
Other rumors indicate a 18MP camera with another smaller "UltraPixel" camera.
The logo bezel is actually small enough to not hate it...
I'm going to guess a bigger push for wireless charging
Rumored release date July/August 2014
While details are scarce, and of course completely unsubstantiated, the M8 Prime is supposed to be equipped with a Snapdragon 805 SoC, a 5.5-inch WQHD (1,440 x 2,560) screen and have 3 GB of RAM. It will be HTC's first phone that has a 300 Mbps CAT 6 LTE modem (part of the SD805 feature set), and will also be waterproof, like the Galaxy S5 and Xperia Z2. The most interesting specification that has been leaked, though, is the material from which it is made. HTC has always pushed the envelope when it comes to the materials it crafts its handsets from, and if @evleaks is to be believed, the M8 Prime will be "made out of an exotic material, a composite of aluminum and liquid silicone."
Other rumors indicate a 18MP camera with another smaller "UltraPixel" camera.
The logo bezel is actually small enough to not hate it...
I'm going to guess a bigger push for wireless charging
Rumored release date July/August 2014
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