I've pasted desktop CPUs multiple times and even delidded my 4770k and applied Liquid Ultra directly to the die, but, I have an i7 quad core laptop CPU coming and I want to make sure I don't have to waste time or risk issue with disassembling the laptop all over again to repaste if I don't do it right the first time.
The reason I ask is because you can see from the pic that the OEM thermal pad/paste thing is actually bigger than the size of the CPU die itself. Couple of things:
1. Is it necessary to cover that much area with a new thermal compound for laptop heatsinks?
2. If I use liquid ultra on the die, do I have to make sure not to get any on the PCB area of the chip itself?
3. If I choose to use MX-4 instead, is it okay if I get some on the PCB area of the chip itself?
4. What is the preferred method for apply paste to laptop dies, assuming I'm using MX-4, should I do a straight line or compound down the length of the die or is there an alternative?
Thank you for any expertise.