Sabrewulf...
Gawd
- Joined
- Jan 18, 2008
- Messages
- 1,019
Have been trying to find out what temperature is used to reflow, but have come up with no exact figure, I think it must be a little over 400 F.
Here's some solder info,
* SnAgCu solders are used by two thirds of Japanese manufacturers for reflow and wave soldering, and by about ¾ companies for hand soldering.
o SnAg3.0Cu0.5, tin with 3% silver and 0.5% copper, has a melting point of 217 to 220 °C and is predominantly used in Japan. It is the JEITA recommended alloy for wave and reflow soldering, with alternatives SnCu for wave and SnAg and SnZnBi for reflow soldering.
o SnAg3.5Cu0.7 is another commonly used alloy, with melting point of 217-218 °C.
o SnAg3.5Cu0.9, with melting point of 217 °C, is determined by NIST to be truly eutectic.
o SnAg3.8Cu0.7, with melting point 217-218 °C, is preferred by the European IDEALS consortium for reflow soldering.
o SnAg3.8Cu0.7Sb0.25 is preferred by the European IDEALS consortium for wave soldering.
o SnAg3.9Cu0.6, with melting point 217-223 °C, is recommended by the US NEMI consortium for reflow soldering.
* SnCu0.7, with melting point of 227 °C, is a cheap alternative for wave soldering, recommended by the US NEMI consortium.
* SnZn9, with melting point of 199 °C, is a cheaper alloy but is prone to corrosion and oxidation.
* SnZn8Bi3, with melting point of 191-198 °C, is also prone to corrosion and oxidation due to its zinc content.
* SnSb5, tin with 5% of antimony, is the US plumbing industry standard. Its melting point is 232-240 °C. It displays good resistance to thermal fatigue and good shear strength.
* SnAg2.5Cu0.8Sb0.5 melts at 217-225 °C and is patented by AIM alliance.
* SnIn8.0Ag3.5Bi0.5 melts at 197 to 208 °C and is patented by Matsushita/Panasonic.
* SnBi57Ag1 melts at 137-139 °C and is patented by Motorola.
* SnBi58 melts at 138 °C.
* SnIn52 melts at 118 °C and is suitable for the cases where low-temperature soldering is needed.
http://en.wikipedia.org/wiki/Solder
Take your pick, but I'd say its the top one @ 217 - 220 C or 417.2 - 428 F
a bit toasty...
Think I'll try the OP's temp at 385 F first with my X850XT and an ancient original Radeon
Here's a neat link about how Motherboards are made - http://www.pcstats.com/articleview.cfm?articleid=1722&page=1
Here's some solder info,
* SnAgCu solders are used by two thirds of Japanese manufacturers for reflow and wave soldering, and by about ¾ companies for hand soldering.
o SnAg3.0Cu0.5, tin with 3% silver and 0.5% copper, has a melting point of 217 to 220 °C and is predominantly used in Japan. It is the JEITA recommended alloy for wave and reflow soldering, with alternatives SnCu for wave and SnAg and SnZnBi for reflow soldering.
o SnAg3.5Cu0.7 is another commonly used alloy, with melting point of 217-218 °C.
o SnAg3.5Cu0.9, with melting point of 217 °C, is determined by NIST to be truly eutectic.
o SnAg3.8Cu0.7, with melting point 217-218 °C, is preferred by the European IDEALS consortium for reflow soldering.
o SnAg3.8Cu0.7Sb0.25 is preferred by the European IDEALS consortium for wave soldering.
o SnAg3.9Cu0.6, with melting point 217-223 °C, is recommended by the US NEMI consortium for reflow soldering.
* SnCu0.7, with melting point of 227 °C, is a cheap alternative for wave soldering, recommended by the US NEMI consortium.
* SnZn9, with melting point of 199 °C, is a cheaper alloy but is prone to corrosion and oxidation.
* SnZn8Bi3, with melting point of 191-198 °C, is also prone to corrosion and oxidation due to its zinc content.
* SnSb5, tin with 5% of antimony, is the US plumbing industry standard. Its melting point is 232-240 °C. It displays good resistance to thermal fatigue and good shear strength.
* SnAg2.5Cu0.8Sb0.5 melts at 217-225 °C and is patented by AIM alliance.
* SnIn8.0Ag3.5Bi0.5 melts at 197 to 208 °C and is patented by Matsushita/Panasonic.
* SnBi57Ag1 melts at 137-139 °C and is patented by Motorola.
* SnBi58 melts at 138 °C.
* SnIn52 melts at 118 °C and is suitable for the cases where low-temperature soldering is needed.
http://en.wikipedia.org/wiki/Solder
Take your pick, but I'd say its the top one @ 217 - 220 C or 417.2 - 428 F
a bit toasty...
Think I'll try the OP's temp at 385 F first with my X850XT and an ancient original Radeon
Here's a neat link about how Motherboards are made - http://www.pcstats.com/articleview.cfm?articleid=1722&page=1