Does Ivy still use cheap Thermal Paste between the Chip?

@Makeroflostsouls No, because the lid is already leveled when I checked with a razor blade. If your aftermarket heat sink is convex then you should concentrate on lapping that instead.
 
We are lucky to have K series parts. That's probably all the love we'll get.

They love us so much they also opted to stuff them with the HD4000/3000 graphics so we pay more out of pocket too. Don't forget that!


I heard or read some site that it was Intel's strategy to boost hex core or remaining Sandy Bridge sales...

No, Intel has stated that they wish to push everyone to Ivy. They're 22nm FinFETs process is running very well and yields are supposedly great, thus they can make more wafers per chip and get more $$$ from each Ivy chip sold. They quoted something like 70% market penetration in a year compared to Sandy as the goal. The cheapo TIM is likely just a cost-saving measure.

Isn't it dandy when you've got only one company at the top?
 
They love us so much they also opted to stuff them with the HD4000/3000 graphics so we pay more out of pocket too. Don't forget that!




No, Intel has stated that they wish to push everyone to Ivy. They're 22nm FinFETs process is running very well and yields are supposedly great, thus they can make more wafers per chip and get more $$$ from each Ivy chip sold. They quoted something like 70% market penetration in a year compared to Sandy as the goal. The cheapo TIM is likely just a cost-saving measure.

Isn't it dandy when you've got only one company at the top?

It is when you work for that company or own it.
 
Ok I'm seriously considering to remove the HSF, remove the motherboard socket holder, apply some thermal grease and use the Noctua cooler with back plate and spring loaded screws to keep the CPU pressed to the motherboard with the DIE directly attached to the sink. What are your thoughts on that?

The board sits horizontally so gravity is it's friend
 
Isn't it dandy when you've got only one company at the top?

AMD needs to get their shit together already and kick Intel in the dick a few times to keep them in line. They're getting way too powerful and cocky. It's bad for the industry, it's bad for technological progress, and it's bad for the people they're ripping off.

It's ridiculous that a new 2500k is still around $215-220, what is it now, 2-3 years old?
 
AMD needs to get their shit together already and kick Intel in the dick a few times to keep them in line. They're getting way too powerful and cocky. It's bad for the industry, it's bad for technological progress, and it's bad for the people they're ripping off.

It's ridiculous that a new 2500k is still around $215-220, what is it now, 2-3 years old?

I agree. I love intel, but AMD's struggles are VERY bad for all of us. Competition is a good thing. Without it, intel's R/D sits on its laurels.
 
Ok I'm seriously considering to remove the HSF, remove the motherboard socket holder, apply some thermal grease and use the Noctua cooler with back plate and spring loaded screws to keep the CPU pressed to the motherboard with the DIE directly attached to the sink. What are your thoughts on that?

The board sits horizontally so gravity is it's friend



CL Liquid pro and be gentle on mount. only on horizontal flat surface with heavy heat sinks and bare die mount.
 
We are lucky to have K series parts. That's probably all the love we'll get.

They love us so much they also opted to stuff them with the HD4000/3000 graphics so we pay more out of pocket too. Don't forget that!

Don't forget K parts are missing VT-d as well, just to keep serious VM users away from them.

Ok I'm seriously considering to remove the HSF, remove the motherboard socket holder, apply some thermal grease and use the Noctua cooler with back plate and spring loaded screws to keep the CPU pressed to the motherboard with the DIE directly attached to the sink. What are your thoughts on that?

The board sits horizontally so gravity is it's friend

Socket A processors had an exposed die and was specified to handle 300 gram when mounted vertically. The Noctua is 900 gram without fan and you plan to use spring loaded screws, that should ensure a limited pressure and work well as long as you use it horizontally. It could even work vertically, but I would be careful.
 
I've got a 2600K @ 4.6 24/7 running nice n cool. I really want IB/Z77's new features, but I'm not sure if a 3770K @ 4.6 will be quite as easy or nice n cool. Anybody have advice besides delidding?
Is 4.6 an easily attainable goal for the 3770K? Cooler's a 2-fan TRUE.

I didn't delid my 3770k, no plans to. I'm running 4.5ghz at stock voltage on my Gigabyte Z77x-UD3H. Just bumped the multiplier and let it fly.
On a quick stress test through AIDA64 the max temp was around 75 with a Hyper 212+.
Idle temps top at 36.
Good enough for me. I'm just an average home user, play some games like Skyrim and Starcraft 2, play around with Lightroom and Photoshop and other home user tasks. Some Handbrake conversions and downloading of Linux iso's.

This was a great upgrade (Z77 + 3770k) for my old Phenom x6 and its associated 760g motherboard. The overall package of features included in the z77 chipset + the 3770k is definitely noticeable to the old AMD gear.
 
Hey JoeJoe69, have you removed your HS/Fan from your CPU to check on how the Liquid Pro is doing with the metal that your HS is comprised of?

I've read that this thermal compound eats aluminium for a snack.

My own Ivy Bridge arrives today, as well as a Asus Sabertooth Z7 board. Will be a nice match to the nVidia 680 I've had for a while.
 
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