DAN Cases is back with a new idea...
This time I try to develop the best CPU heatsink under 50mm. The aim is a heatsink that keeps the temperatures up to 15°C lower than existing competitors like the C7 or L9i. Furthermore I will focus on noise level, because current heatsinks that come close to the side panels in cases like A4-SFX or Sentry generate some disturbing noise because of air turbulence
The project name is HSLP-48 (HeatSinkLowProfile-48). The current design is based on Thermalrights AXP100 series but the HSLP-48 is wider and lower.
The idea is a heatsink with a sandwich layout. On the bottom there is the CPU plate with six heatpipes, after that a 100mm FAN (92mm mountpoints) with a thickness of 14mm and on top 47 fins with a thickness of 17mm. The total hight will be 48mm. The fins will be above the RAM and the I/O area (audio, USB s.o.) of the motherboard.
The fan will be mounted with four anti vibration rubbers. The rubbers allows you to mount the fan centered or you can shift it to the left or right side. You will be able to mount 92mm, 100mm or 120mm fans. You can mount a full size 120mm fan on top or a low profile 120mm fan (max. 15mm) under the heatsink. The distance from the fan to the side panels will be min. 17mm so it will not generate air turbulence.
I plan to cooperate with Thermalright on this project and I am also considering Noctua as an option. The big advantage of Thermalright is the TY-100 fan, the best rentention kits on the market for all sockets and existing products that are very similar to my heatsink that will lower tooling fees.
Socket Support: 1155. 1151, 1150, 1156, 2011 square and narrow Ilm, AM4
Total Dimensions: 48 (H) mm x 130 (W) mm x 137,5 (L) mm - including heatpipes
Fin Area Dimension: 18,5 (H) mm x 130 (W) mm x 110 (L) mm, 48 fins
Material: copper and aluminum
Heatpipes: 6x 6mm heatpipes
Fan: Thermalright TY-100 (custom color)
Total Surface: 103896mm² (I plan to reduce the spacing between fins this will end in a surface of 142269mm²)
Price Tag: 30-60€
The heatsink should be as compatible as possible. You can use RAM with normal height, you will have full access to the PCIe port. You can access the SATA ports (in some cases you need angled connectors). The heatsink will work on boards with the socket close to the PCIe port and close to the topside. If the 100mm fan will not fit between the I/O area and RAM (ASUS ROG Maximus VIII Impact) you can use a default 92mm fan. If you have more space you can mount a 120mm on top. Currently there is only one board from the Z270 series that gives problems. I talk about the ASUS ROG Strix Z270I Gaming. The CPU phase heatsink is too high. Some users mention that the Nexus will fit. If this is true, the HSLP-48 will also fit. I will not make a heatsink that only fits in the A4-SFX. I think a heatsink will have a high MOQ so I need to sell more heatsink as we have A4-SFX currently on the market.
How much space is between FAN and bottom plate?
How much space is under the fan?
Is it possible to unscrew the heatsink without removing the motherboard?
Yes, because the heatsink is secured with two screws to Thermalrights special retention kit.
Why there is a small cut on each side of the fin surface?
You will need that gap for your screw driver to mount the heatsink.
Is a full copper version an option?
Yes if it will be inside my price range!
When will this heatsink reach the market?
Currently I don't have a manufacturer and a prototype. So the release can be in the next 6 month or never if the results of the prototype are bad.
What are the keyfeatures of a good heatsink?
1.) A good heat transfer between CPU plate and fins area
2.) A good heat transfer between CPU and CPU plate
3.) A big surface for a good heat exchange
To optimize my current design I will analyze it based on the three tesis:
A good heat transfer between CPU plate and fins area.
We have 6 x 6mm heatpipes I think this is enough
A good heat transfer between CPU and CPU plate.
Thermalright is able to produce direct touch heatpipes. I think this will be a great option for the HSLP-48. Furthermore this will lower the CPU plate from 10,5mm to 6,5mm. So I can add some mm to the thickness of the fins.
A Vapor-Chamber is not necessary because of the tiny surface of the CPU plate. Furthermore I have to pay patent license for it if I have it correct in my mind.
A big surface for a good heat exchange.
- The surface of the current design is:
normal fins = 17 (H)mm * 121 (L) mm * 42 count = 86394mm²
small fins = 17 (H)mm * 59 (L) mm * 5 count = 5015mm²
5% lost area for heatpipes hole
- What does the other compatitors have?
C7 = 27 (H)mm * 97 (L) mm * 57 count * 0.75 (25% lost for heatpipes) = 111962mm²
L9i = 21 (H)mm * 95 (L) mm * 56 count * 0.85 (15% lost for heatpipes) = 94962mm²
So you see currently the HSLP-48 will have the smalles surface. To address that problem I will increase the hight to 18,5mm and the length to 130mm. Furthermore I will reduce the fin spacing from 1.88mm to 1.2 mm like the C7. This will increase the surface.
- Here is the new surface calculation:
normal fins = 18.5 (H)mm * 130 (L) mm * 60 count = 86394mm²
small fins = 18.5 (H)mm * 59 (L) mm * 5 count = 5015mm²
5% lost area for heatpipes hole
These changes will increase the surface extremely (64% more surface). But I have to talk with Thermalright about the topic why the choose a fin spacing of 1.88mm
There would be no way to mount it to the sidepanel, but I like the idea.
So the work on my heatsink from my side is nearly done. I don't have any specification on AM4 socket. I think I have to contact AMD for more details.
Here is a preview on 2011-3 Narrow ILM
I never got a new price from Thermalright. The last message from them (the German middleman) was 10 days ago. I am still waiting but I think it will be impossible working on a project like this with them with such a delay in communication.
From CoolJag I get 1-2 mails every day. I can feel that they are interested in this project. I think I will get a price this week.
This evening I send an e-mail to the German middleman company that forwards my messages to Thermalright, that I am not longer interested in acooperation with them, because a project like this can't work without communication.
Their fanless solutions work with large and heavy heatsinks, the size of the case. They have no small and light solutions and they rely on building their own cases so non of the technologies they currently have are efficient with cases built for aircooling. That is why you can see that most of their solutions involved their own custom built case and they are pretty heavy which defeats the purpose of a small portable case.
The way I understood it, is that the "loop heat pipe" is only more efficient over long distances. For short distances the normal capillary pipes outperform loop pipes. In the HSLP-48 there is no need for long distance pipes.
Calyos may also produce stand-alone loop heat pipe coolers