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AMD’s chief technology officer, Mark Papermaster, has called the planned shift to 7nm semiconductor nodes one of the toughest process moves in several generations: in addition to new CAD tools and architectural changes, the transition has forced the company to develop deeper partnerships with foundries. Papermaster expects that foundries will begin to use extreme ultraviolet (EUV) lithography starting in 2019 to reduce the need for quad patterning.
To gear up for 7nm, “we had to literally double our efforts across foundry and design teams…It’s the toughest lift I’ve seen in a number of generations,” perhaps back to the introduction of copper interconnects, said Mark Papermaster, in a wide-ranging interview with EE Times. The 7nm node requires new “CAD tools and [changes in] the way you architect the device [and] how you connect transistors—the implementation and tools change [as well as] the IT support you need to get through it,” he said.
To gear up for 7nm, “we had to literally double our efforts across foundry and design teams…It’s the toughest lift I’ve seen in a number of generations,” perhaps back to the introduction of copper interconnects, said Mark Papermaster, in a wide-ranging interview with EE Times. The 7nm node requires new “CAD tools and [changes in] the way you architect the device [and] how you connect transistors—the implementation and tools change [as well as] the IT support you need to get through it,” he said.