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Every single high end K sku on a Z platform has had at least 91W TDP since well, forever. There's no reason to believe that'll change this generation, especially given all the issues Intel has had making a working chip to begin with. The die shrinks always benefit the low power systems. High end...

A die shrink isn't going to solve your problem. In fact, it'll make it worse. The smaller the die, the more concentrated the heat, the harder it is to dissipate. Dan himself said this is why he didn't rate the heat sink for a specific TDP. It's just not a good idea to put high end Intel chips in...