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What I'm trying to say is: It's probably not worth it because push+pull might give you a slight bonus (read: diminishing returns) normally with additional same thickness fans (read: by sacrificing additional 25mm space) but it's probably not gonna do much in this case cause we're swapping better...

Push pull is pointless, especially on a thin radiator. What are you gaining from push pull is more static pressure. What you're losing from using low profile fans is static pressure. What you're gaining from using a low profile radiator is lower pressure drop -> higher airflow. It makes no...

Oh I made a small mistake. The height of the feet obviously change that angle too. The higher the feet, the smaller the angle becomes. So three conflicting design goals: stability: as low as possible with as wide a base as possible design: low with a narrow base for the current design...

Or a short. Also you don't need to cool NAND flash. All you want to cool is the controller chip. NAND flash has higher endurance when it's running at higher temps. Cause the energy and thus voltage needed to tunnel charges onto the isolated control gate is lower at higher temperatures, which in...

AlMiDaX The problem is ONLY the area that the feet enclose. As long as it's the same or smaller than the original (assuming same height of the center of gravity), it won't change anything for stability. It's the marked area (and by extension the angle) that determines how much angular (tipping)...

Case feet: First the unevenness. This is a problem with everything with more than 3 feet. If it's uneven I would say that's a reason to complain to LianLi. I mean other cases have 4+ corner contact patches too and seem to work fine. This is a quality assurance problem and should lie with Lian...

I just don't like rounded corners in general. This looks too simple. It's just a rounded box with a glass side. It's not ugly but it doesn't have any interesting lines and details to catch the eye. If you want a box that melts into the background than I guess this would work. But when you want...

SFF is not for you bro.

dondan You mean this part gets scratched?: That's not visible once the panel is on. But if you really want to redesign because of this. You could just trim the top and bottom panels down so they are flat pieces without any bending. Extend the side panels so they fill the entire side, no...

It's not front intake. Look more closely. It's exhaust. This is a negative pressure setup, pulling air through the rads by exhausting through the front. I'm not into this design. Firstly it looks meh. Secondly it probably creates a pretty stagnant air pocket in the top corner of the mainboard...

Lol he said this thread is dead. Guess he didn't realize we were waiting for more test results.... I agree on the unibody thing. Sure the A4 is kinda his baby, but it's just one case. I don't think just because hsi first case had that unibody design means that every case needs to have it now...

Project is dead :0

I mean rotated like the bottom radiator. So the fittings won't collide with anything.

Has anyone tried fitting a low profile radiator to the top fan spot and a low profile fan between the front panel and frame? EK 120SE is 27mm thick so it might fit. And there is a 12mm thick fan from Scythe

Delid it. I mean... who uses a 8700k without delid?

But why would you close up airflow where the aesthetic does not matter? An air filter is more than enough for the bottom, don't close it up. Also darker tint window is awesome.

Could you test raising the case a bit more off the surface and see if the temps drop? (And maybe redesign the feet with a reassessed temp/looks consideration) The only reason why bottom rad pull in is worse than top rad pull in that I can think of is restricted airflow because of low ground...

2. I imagine that would make flipping the front IO a bit more difficult. Also those fold overs on the bottom seem to be part of the feet design. But I agree on the edge to edge panels. It would also make the thickness of the glass a none issue. The flippable design is actually the biggest thing...

I'm thinking of a custom CPU loop with an aircooled GPU. I'm hoping that a small pump like this will fit under the PSU. And a custom sandwich style acrylic res to fill the space between the GPU and radiator. But I'll have to await final measurements to make sure of the clearances first.

Dude I think you need to sit down and go through this again... Even if the I/O was on top. how would you solve main side panel to be on the right vs left side? You HAVE TO flip the case for that. Top radiator will turn into bottom radiator, that's all. I'm not sure what problem you have with...

The more angular design reminds me more of Microsoft rather than the bubbly bigger radius corners Apple prefers to use. And I prefer it this way. Apple's design is too feminine for me. I also prefer the side IO with the cutout in the glass. It just makes this case special rather than being...