I know everyone is salivating over some real world reviews of gen 3 Ryzen, but it is worth appreciating some of the overlooked technical achievements of the new CPU.
TPU has a nice article that articulates the effort that needed to go into making a multi die layout work with the older monolithic designed packages:
https://www.techpowerup.com/256511/amd-ryzen-3000-matisse-i-o-controller-die-12nm-not-14nm
TPU has a nice article that articulates the effort that needed to go into making a multi die layout work with the older monolithic designed packages:
https://www.techpowerup.com/256511/amd-ryzen-3000-matisse-i-o-controller-die-12nm-not-14nm