Ryzen Delid Cooling test: No Significant Improvement

S

Snowdog

[H]F Junkie
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There was a previous Delid video. The one that fooled some of us (me) into thinking it was a dual die chip.

This is the followup, where he scrapes off the solder and cleans up the die (makes it very clear that it is a single die), applies liquid metal thermal paste, and does a direct die test.

Temps only improve by about 1 degree. Indicating that AMDs soldered heat spreader is just about ideal.

 
like i said in the other thread, maybe a couple degrees. amd does a really good job with their ihs.
 
Such a weak fan on that cooler he used. Bummer he was not able to mount a waterblock.

More testing needed.
 
It might make a huge difference if the heat sink is saturated with heat and not able to transfer heat due to thermal transfer design. The heat sink though large had a very weak fan.

Also his results did not capture the same conditions. He should have used exact same cpu with the exact same heat sink before and after.
 
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I might get a R5 1600 when it becomes available.

Till then I'll be sitting in the back seat eating popcorn.
 
Two things I hope Ryzen does to Intel :

1) Lower Skylake-X price
2) Switch mainstream CPUs back to solder
Bonus) Light a fire under their a*s in general :)
 
Snowdog said:
There was a previous Delid video. The one that fooled some of us (me) into thinking it was a dual die chip.

This is the followup, where he scrapes off the solder and cleans up the die (makes it very clear that it is a single die), applies liquid metal thermal paste, and does a direct die test.

Temps only improve by about 1 degree. Indicating that AMDs soldered heat spreader is just about ideal.

Click to expand...


I guess someone had to do it to prove it. (y)
 
Didn't expect there to be much difference. After all, AMD didn't have their head up their ass when they stuck with a soldered IHS, unlike another company we know...
 
how hot do they have to get the solder to liquefy and adhere to the CPU die, also did they have to ad some kind of metal to the top of the CPU die to make the solder take or is it just sitting there held by the heat spreader alone?
 
not sure aboot temps but they do add a layer of gold to the underside of the heat shield so it sticks.
 
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