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well, at least the renames from the prior roadmaps didnt change.
now the question is whether the new names denote a process/silicon change or not.
They did that with Pitcairn in the 200 series.you dont usually do a name change if its identical.
Verified the naming scheme: The leak today was the R7 370, a retail part. The OEM model shown on AlienWare's website is the R9 370.
So, they are two different cards. The OEM R9 370 is a rebranded 7850. The retail R7 370 is an unknown GCN 1.0 chip (Probably 7870).
Zarathustra[H];1041653302 said:I hate that they do this (Intel is the worst offender though).
The product names should make logical sense, and be uniform across product ranges.(mobile, desktop and OEM).
Using an Nvidia example, if you call something a GTX 980m it had better perform similarly to a desktop GTX980.
Using the AMD example above, if you reuse the number 370, it should perform on the same level as other 370's. Nvidia is terrible here with their OEM models that otherwise have the same product name, but differ from the desktop counterparts (usually slower).
Intel's product names are all over the fucking place.
You should be able to take one look at a companies product name, and know how it performs compared to other products in the lineup. Seeing two products of the same generation by the same company side by side in a store, you should be able to figure you which is fast just by the product name, without having to pull out your phone and read benchmarks.
A lot of the time it feels like the product naming schemes are designed to confuse the casual buyer, rather than inform them.
It is really god damned annoying, and what happens when you put marketing people in positions of power.
Engineers should be naming the products.
"Marketing is too important to be left to the marketing department".
--David Packard (of HP)
It makes no sense to me. They are consolidating the 280, 285, and 280X into a single 380? Which at this point I hope is a full Tonga... otherwise, wtf?So according to videocardz, a May slide from AMD shows them having new GPU names...
http://videocardz.com/56205/amd-radeon-300-series-roadmap-leaked
I'm feeling more confident that these are manufactured with goflo and include significant improvements in heat, power, and even performance... all with extra clock bumps and more vram
?
It's so ridiculous it almost seems fake.
The slides are from May, possibly older than the "Fury" label.
Zarathustra[H];1041653302 said:I hate that they do this (Intel is the worst offender though).
The product names should make logical sense, and be uniform across product ranges.(mobile, desktop and OEM).
Generally, the more AMD hypes a product the more disappointing it is.I'm terrible at waiting.
I've been reading every new page of this thread. Brazilian coal miner work conditions through the benefits of running high TDP equipment in the Northern Latitudes and the costs associated with it. All while hoping for some delicious AMD crumbs, and all I'm left with is this hotdog bun...
I know it's only a few more days but damn, the suspense is killing me
Anyone else see an ice cream sandwich?
Generally, the more AMD hypes a product the more disappointing it is.
All of these little teaser videos and the 6.16.2015 thing at Computex... Not a good sign.
nice...
its going to have Android in it!! (a very old version aparently)
pretty sure hes referring to bulldozer..
What's wrong with mayo?
Mayo on a hot dog? Now I think the rest of us can all agree on one thing...mayo on a hot dog just ain't right.
Based on which GPUs?
Fiji, and the Fury line of cards which are based on it, feature notable improvements across the board. Performance is obviously significantly improved. Fury X is faster than the R9 290X by a minimum of 54%. Which brings us to the second major improvement. Fury X achieves this performance improvement with a TDP that’s a meager 10W higher. Which makes Fury X 48% more power efficient than AMD’s previous single GPU flagship the R9 290X, which is quite remarkable.
We’ve also been told that since Fiji’s die is measurably bigger than that of Hawaii, it’s considerably easier to cool. Because the heat will be distributed across a larger surface area, which will allow it to dissipate more readily. This is good news, especially considering that AIBs will also be bringing out newer and more effective cooling solutions.
On an even brighter note, we’ve been told that AMD’s reference air cooler for Fury X and Fury is actually quite beefy. And will keep the chips cool even with an overclock. The cooler features three axial fans blowing air onto a large heatsink.
if you mix Mayo, Ketchup and a bit of mustard you will get the best Hotdog sauce ever made.. just try.. its called "Pink Sauce"
It's a conspiracy! I knew AMD was involved.The "Lagon bleu" is a famous burger restaurant based in Taunoa, Tahiti and the original recipe of this sauce is a secret.
Generally, the more AMD hypes a product the more disappointing it is.
All of these little teaser videos and the 6.16.2015 thing at Computex... Not a good sign.
That's also McD's special sauce.
http://www.foodrepublic.com/2013/01/23/how-make-secret-sauce-your-burger
It's a conspiracy! I knew AMD was involved.
Bigger gap between the XT and Pro than I thought if those specs are true.
Wonder if Fiji Pro will be going head to head with 980 Ti/TX while Fiji XT will be in a different class altogether.