cornelious0_0
[H]F Junkie
- Joined
- Apr 6, 2003
- Messages
- 12,783
This isn't a ridiculously serious issue, nor is it a motherboard defect. What I'm referring to is actually that after the stock Intel heatsink is installed, there is a very heavy bend in the motherboard under the processor. At first I didn't think anything of it, but I have now re-seated the cooler with better paste and made sure that all 4 push-pins were securely pressed down. At the moment my E4300 is clocked at 3.2GHz and set in BIOS to 1.350v (runs at 1.312v load) and hits load temperatures of 70C+. I'm using TAT to monitor temps, so there's no way it's being reported incorrectly, and I know that my temps should be a fair bit lower, compared to any HSF reviews I've seen where an X6800 or other Conroe is used.
I'm planning on getting a Thermalright Ultra-120 Extreme and either lapping or removing the IHS to really "fix" my temps...but until then I'd really like to know what's going on.
I know that the Ultra-120 comes with a back plate which should eliminate any flexing, but do you guys think it's actually possible that the board bending enough under the CPU could effect HSF contact?
If not, what do you think? I've tried everything I could think of and still the temps remain far too high for my current clock speed/voltage as far as I've seen.
I'm planning on getting a Thermalright Ultra-120 Extreme and either lapping or removing the IHS to really "fix" my temps...but until then I'd really like to know what's going on.
I know that the Ultra-120 comes with a back plate which should eliminate any flexing, but do you guys think it's actually possible that the board bending enough under the CPU could effect HSF contact?
If not, what do you think? I've tried everything I could think of and still the temps remain far too high for my current clock speed/voltage as far as I've seen.