Intel Announces New Packaging and Test Technologies for Foundry Customers

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Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies. Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a breakthrough that enables a lower cost and simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package. Instead of an expensive silicon interposer with TSV (through silicon via), a small silicon bridge chip is embedded in the package, enabling very high density die-to-die connections only where needed. Standard flip-chip assembly is used for robust power delivery and to connect high-speed signals directly from chip to the package substrate. EMIB eliminates the need for TSVs and specialized interposer silicon that add complexity and cost.
 
And the question of the day is.... Will this savings be passed on to customers?
 
A bigger question.

When will nvidia become an Intel customer?
 
"high density interconnects between heterogeneous dies on a single package"

AMD leads with HSA, and Intel follows. :)
 
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